- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/03 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes
Patent holdings for IPC class H01L 25/03
Total number of patents in this class: 330
10-year publication summary
39
|
43
|
26
|
35
|
20
|
24
|
12
|
15
|
13
|
2
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
74 |
STATS ChipPAC Pte. Lte. | 1516 |
31 |
Jcet Semiconductor (shaoxing) Co., Ltd. | 366 |
21 |
Intel Corporation | 45621 |
16 |
Samsung Electronics Co., Ltd. | 131630 |
14 |
Micron Technology, Inc. | 24960 |
8 |
Apple Inc. | 50209 |
7 |
Qualcomm Incorporated | 76576 |
6 |
SK Hynix Inc. | 11030 |
6 |
Mediatek Inc. | 4584 |
5 |
Semiconductor Energy Laboratory Co., Ltd. | 10902 |
4 |
Samsung Electro-mechanics Co., Ltd. | 4798 |
4 |
Face International Corp. | 88 |
4 |
Invensas Corporation | 645 |
4 |
Siliconware Precision Industries Co., Ltd. | 489 |
4 |
Kioxia Corporation | 9847 |
4 |
Kulicke and Soffa Industries, Inc. | 292 |
4 |
Adeia Semiconductor Technologies LLC | 47 |
4 |
International Business Machines Corporation | 60644 |
3 |
Renesas Electronics Corporation | 6305 |
3 |
Other owners | 104 |